Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Products specifications
Product | Heat Sinks |
Width | 25.4 mm |
Height | 0.33 mm |
Designed for | BGA, PGA, QFP |
Heatsink Material | Copper |
Mounting Style | Adhesive |
Length | 101.6 mm |