Heat Sinks Thin-Fin Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm
Products specifications
Product | Heat Sinks |
Height | 0.33 mm |
Designed for | BGA, PGA, QFP |
Heatsink Material | Copper |
Width | 12.7 mm |
Mounting Style | Adhesive |
Length | 50.8 mm |