Heat Sinks Extruded Heat Sink for Leadless Chip Carriers, Radial Fin, Round, 1.0x0.3 Inch
Products specifications
Height | 7.62 mm |
Mounting Style | Adhesive |
Designed for | 68 Position Devices, Microprocessors |
Fin Style | Extruded Radial Fin |
Heatsink Material | Aluminum |
Product | Heat Sinks |